Paper Submission

The following paper submission policies will be applicable for iAIM 2017.

Originality:

Papers submitted to iAIM 2017 should contain original research/study and should not have been published or submitted for publication elsewhere. The IEEE anti-plagiarism policy is applicable to all submissions. Only the author(s) is responsible for any plagiarized submission. http://www.ieee.org/publications_standards/publications/rights/plagiarism.html

Paper Format:

Papers submitted to iAIM 2017 should be written in the English language and can be a minimum of FOUR pages long and a maximum of SIX pages long (papers that are less than 4 pages long or more than 6 pages long will not be considered for review). This limit is inclusive of all text, figures, tables, acknowledgements, references and appendices.

The authors are required to use the standard IEEE manuscript template for conferences. The Microsoft Word template in A4 page size can be downloaded from here and the LaTeX template (as a zip file) can be downloaded from here. Alternatively, the templates can be downloaded (both Microsoft Word in A4 size and LaTeX formats) from IEEE conference templates page:

http://www.ieee.org/conferences_events/conferences/publishing/templates.html

iAIM 2017follows single-blind review process – so please include all authors’ name and affiliation in the paper while submitting for review.

Paper Submission Process:

All papers must be submitted in PDF or as a Microsoft Word Document via EasyChair : https://easychair.org/conferences/?conf=iaim2017 . The submitting authors may be required to create an EasyChair account before uploading the paper (if the submitting author does not have an EasyChair account). While uploading the paper, the authors should provide the title of the paper, an abstract of no more than 250 words and keywords in the respective text boxes in the paper submission page.

Please note that all accepted papers and posters that are registered and presented in the conference will be sent for publication in IEEE Xplore.