Workshop on 5G (26/11/2017, 9.00AM-11.00AM)
- IEEE 5G Initative: Community Engagement with Industry for Advanced Microwave and Millimeter-Waves Technologies
Abstract: 5G is the next generation wireless technology that is expected to significantly increase data speeds, produce ultra-low latency times, support the connection of many more devices, and increase energy efficiency of the network elements. Future applications that will require the characteristics of 5G include Autonomous vehicles, Remote health services and health care monitoring, AR/VR, smart homes, Industrial automation and IoT.The IEEE 5G Initiative has started a roadmapping activity to help guide the community to work together, identify drivers and technology needs, etc. to accelerate the successful adoption of 5G technology. There will the need to for dramatic improvements in semiconductors, antenna, beamformers, and advanced packaging at both microwave and millimeter-wave frequencies to support low-cost high performance 5G Radio Transceivers for base transceiver station (BTS) and user equipment (UE) for mobile and fixed wireless applications.For millimeter-wave 5G hardware: the package is the system. In this talk, I will highlight the engineering challenges and show some examples of highly integrated 5G modules that will be needed to meet the demands of the 5G ecosystem.
Timothy Lee, currently a Boeing Technical Fellow, is responsible for the development of RF and digital electronics for advanced communications networks and sensor systems at The Boeing Company (1998-Present). He is leading the development of state-of-the-art CMOS and RFintegrated circuits and devices. Current interests include techniques to overcome the End of Moore’s Law which includes 2.5D/3D heterogeneous integration and hardware designs for 5G millimeter-wave systems.
In the IEEE, Tim has served as the 2015 MTT-S President. In 2017 is serving as a Co-Chair of the IEEE 5G Initiative and the 5G mm-wave technical working group. Tim is working to grow a new generation of technical leaders whose vision is a thriving local communityenabled by Internet and wireless technology. Tim believes that the only true way forward to invest not only in technology infrastructure but to invest in human capital to foster innovation and interactions between communities and technologists.
2. MIMO Array Antenna Designs for Sub-6GHz Future Fifth Generation (5G) Mobile Devices
Prof. Chow-Yen-Desmond Sim, Distinguish Professor, Feng Chia University, Taichung, Taiwan
Abstract: The evolution from present 4G LTE (or beyond 4G, B4G) to future fifth generation (5G) communication technology will be briefly described in this presentation. As the world is preparing to embrace the 5G communication system in the year 2020 or after, its related terminal mobile devices such as smart phone design operating in the sub-6GHz band will be discussed. The recently reported 5G antenna designs with MIMO technology (such as 8×8 MIMO mobile devices) will be introduced, and their vital parameters such as Channel Capacity and Throughput will also be discussed in detail.
Prof. Chow-Yen-Desmond Sim was born in Singapore, in 1971. He received his Ph.D from the Radio System Group, Engineering Department, at University of Leicester, United Kingdom, in July 2003. Since then, he has been working in Taiwan, and in August 2016, he was promoted to Distinguish Professor of the Department of Electrical Engineering, Feng Chia University, Taichung, Taiwan. He is the author or co-author of over 100 SCI journal papers. He is a Fellow of the Institute of Engineering and Technology (FIET), Senior Member of the IEEE Antennas and Propagation Society, and a Life-Member of Institute of Antenna Engineers of Taiwan (IAET). He was awarded three times as the Top Ten Outstanding Reviewers of IEEE Antennas and Propagation Society in 2014, 2015 and 2016. His current research interests include antenna design, VHF/UHF troposphere propagation, RFID applications, and wireless communications. Prof. Sim has received the “Zhiqian Professor” (Distinguish Chair Professor) title by Shanghai University in May 2015. He is now serving as the Executive Officer of Master’s Program, College of Information and Electrical Engineering (Industrial R&D), Director of Intelligent IoT Industrial PhD Program, and Director of Antennas and Microwave Circuits Innovation Research Center of Feng Chia University. Since October 2016, he has been serving as the technical consultant of SAG (Securitag Assembly Group), which is one of the largest RFID tag manufacturers in Taiwan. He is also now serving as the IEEE AP-S Taipei Chapter Chair (2016-2018), and Associate Editor of IEEE Access and Wiley RFMiCAE.
3.Test Challenges of Smart Antenna Systems
Abstract: The proliferation of wireless technologies into every corner of our lives, starting with traditional cellular and wireless LAN technologies and leading to the impending evolution of connected cars and the “Internet of Things,” all require the use of one common asset – bandwidth. While the traditional approach to added bandwidth is simply to use more RF spectrum, the availability of spectrum, especially at frequencies compatible with most of today’s applications, is severely limited. Technologies continue to evolve to make better utilization of the available bandwidth, including MIMO, beam forming, spectrum sharing and reuse, etc. The added complexity of these “smart” antenna systems carries over into the complexity of trying to test radios using these technologies. Smart antenna systems that adapt to their environment are not likely to perform the same way in a traditional laboratory test as they would in the real world. Thus, the laboratory test methodologies must advance to keep up with these innovations to be able to determine the expected over-the-air performance of these devices without requiring an unlimited number of test cases. This presentation will provide an overview on the evolving 5G and mmWave technologies and the resulting dramatic changes to the wireless industry that will impact the way all RF and EMC testing of devices is performed.
Mr. Andy Chung is a Principal RF Engineer, Solution Development for ETS-Lindgren in Tokyo, Japan. He holds an MS degree in Electromagnetic Engineering from the National Taipei University of Technology, Taiwan. Mr. Chung started his career at ETS-Lindgren Taiwan in 2009 as an RF Engineer. He was instrumental in wireless Over-the-Air (OTA) solution system integration and in assisting customers with obtaining CTIA certification in the Asia Pacific region. In March 2016, Mr. Chung assumed the role of Principal RF Engineer and relocated to ETS-Lindgren’s facility in Japan. He is responsible for antenna measurement system (wireless) chamber design as well as EMC chamber design. He is also a member of ETS-Lindgren’s 5G research and development team. His research interests include antenna design using ceramic material, antenna pattern measurements and related software.